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 3803 Group (Spec.L) Standard characteristics
1 Standard characteristics
Standard characteristics described below are just examples of the 3803 Group (spec. L)'s characteristics and are not guaranteed. For rated values, refer to "Electrical characteristics" of Datasheet. 1.1 Mask ROM version power source current standard characteristics High-speed mode (TYP, 25 C) [ = XIN/2, XCIN = 32.768 kHz]
10.0 8.0 6.0 4.0 2.0 0.0 1.0
Icc (mA)
2.0
16.8MHz
3.0 Vcc(V)
12.5MHz
8.4MHz
4.0
4.2MHz
5.0
2.1MHz
6.0
Fig. 1 Mask ROM version power source current standard characteristics (in high-speed mode) Middle-speed mode (TYP, 25 C) [ = XIN/8, XCIN = stopped]
5.0 4.0 3.0 2.0 1.0 0.0 1.0
Icc (mA)
2.0
16.8MHz
3.0 Vcc (V)
12.5MHz
4.0
8.4MHz
5.0
6.3MHz
6.0
Fig. 2 Mask ROM version power source current standard characteristics (in middle-speed mode)
REJ99B1814-0200/Rev2.00
September 2009
Page 1 of 22
3803 Group (Spec.L) Standard characteristics
Low-speed mode (TYP, 25 C) [ = stopped, XCIN = 32.768 kHz]
100.0 80.0
60.0
Icc (A)
40.0 20.0 0.0 1.0 2.0 3.0 Vcc (V) 4.0 5.0 6.0
32.768kHz
Fig. 3 Mask ROM version power source current standard characteristics (in low-speed mode)
High-speed mode, WAIT state (TYP, 25 C) [ = XIN/2, XCIN = 32.768 kHz]
3.0 2.5 2.0
Icc (mA)
)
1.5 1.0 0.5 0.0 1.0 2.0 3.0 Vcc(V)
16.8MHz
(
4.0
5.0
6.0
Fig. 4
Mask ROM version power source current standard characteristics (in high-speed mode, f(XIN) = 16.8 MHz, WAIT state)
REJ99B1814-0200/Rev2.00
September 2009
Page 2 of 22
3803 Group (Spec.L) Standard characteristics
3.0 2.5 2.0
Icc (mA) ()
Middle-speed mode, WAIT state (TYP, 25 C) [ = XIN/8, XCIN = stopped]
1.5 1.0 0.5 0.0 1.0 2.0 3.0 Vcc(V)
16.8MHz
4.0
5.0
6.0
Fig. 5
Mask ROM version power source current standard characteristics (in middle-speed mode, f(XIN) = 16.8 MHz, WAIT state) Low-speed mode, WAIT state (TYP, 25 C) [ = stopped, XCIN = 32.768 kHz]
50.0 40.0 30.0 20.0 10.0 0.0 1.0 2.0 3.0 Vcc(V)
32.768kHz
Icc (A)
4.0
5.0
6.0
Fig. 6
Mask ROM version power source current standard characteristics (in low-speed mode, WAIT state)
REJ99B1814-0200/Rev2.00
September 2009
Page 3 of 22
3803 Group (Spec.L) Standard characteristics
High-speed mode, A-D converter operating (TYP, 25 C) [ = XIN/2, XCIN = 32.768 kHz]
10.0 8.0 6.0 4.0 2.0 0.0 1.0 2.0 3.0 Vcc(V)
16.8MHz
Icc (A)
4.0
5.0
6.0
Fig. 7
Mask ROM version power source current standard characteristics (in high-speed mode, f(XIN) = 16.8 MHz, A-D converter operating)
Oscillation stop mode (TYP, 25 C) [STP instruction executing, XIN = stopped, XCIN = stopped]
1.0 0.8 0.6
Icc (A)
0.4 0.2 0.0 1.0
2.0
3.0
Vcc(V)
4.0
5.0
6.0
stopped
Fig. 8 Mask ROM version power source current standard characteristics (at oscillation stopping)
REJ99B1814-0200/Rev2.00
September 2009
Page 4 of 22
3803 Group (Spec.L) Standard characteristics
1.2 Flash memory version power source current standard characteristics High-speed mode (TYP, 25 C) [ = XIN/2, XCIN = 32.768 kHz]
8.0
6.0
Icc (mA)
4.0
2.0
0.0 2.5 3.0
16.8 MHz
3.5
12.5 MHz
4.0 4.5 Vcc (V)
8.4 MHz
5.0
4.2 MHz
5.5
2.1 MHz
6.0
Fig. 9 Flash memory version power source current standard characteristics (in high-speed mode)
Middle-speed mode (TYP, 25 C) [ = XIN/8, XCIN = stopped]
4.0
3.0
Icc (mA)
2.0
1.0
0.0 2.5 3.0
16.8 MHz
3.5
4.0 4.5 Vcc (V)
12.5 MHz 8.4 MHz
5.0
5.5
6.3 MHz
6.0
Fig. 10 Flash memory version power source current standard characteristics (in middle-speed mode)
REJ99B1814-0200/Rev2.00
September 2009
Page 5 of 22
3803 Group (Spec.L) Standard characteristics
800.0
Low-speed mode (TYP, 25 C) [ = XCIN/2, XIN = stopped]
600.0
Icc (A)
400.0
200.0
0.0 2.5 3.0 3.5 4.0 4.5 Vcc (V)
32.768 kHz
5.0
5.5
6.0
Fig. 11 Flash memory version power source current standard characteristics (in low-speed mode)
High-speed mode, WAIT state (TYP, 25 C) [ = XIN/2, XCIN = 32.768 kHz]
8.0
6.0
Icc (mA)
4.0
2.0
0.0 2.5 3.0 3.5 4.0 4.5 Vcc (V)
16.8 MHz
5.0
5.5
6.0
Fig. 12 Flash memory version power source current standard characteristics (in high-speed mode, f(XIN) = 16.8 MHz, WAIT state)
REJ99B1814-0200/Rev2.00
September 2009
Page 6 of 22
3803 Group (Spec.L) Standard characteristics
Middle-speed mode, WAIT state (TYP, 25 C) [ = XIN/8, XCIN = stopped]
4.0
3.0
Icc (mA)
2.0
1.0
0.0 2.5 3.0 3.5 4.0 4.5 Vcc (V)
16.8 MHz
5.0
5.5
6.0
Fig. 13 Flash memory version power source current standard characteristics (in middle-speed mode, f(XIN) = 16.8 MHz, WAIT state)
Low-speed mode, WAIT state (TYP, 25 C) [ = XCIN/2, XIN = stopped, XCIN = 32.768 kHz]
8.0
6.0
Icc (A)
4.0
2.0
0.0 2.5 3.0 3.5 4.0 4.5 Vcc (V) 5.0 5.5 6.0
32.768 kHz
Fig. 14 Flash memory version power source current standard characteristics (in low-speed mode, WAIT state)
REJ99B1814-0200/Rev2.00
September 2009
Page 7 of 22
3803 Group (Spec.L) Standard characteristics
8.0
High-speed mode, A-D converter operating (TYP, 25 C) [ = XIN/2, XCIN = 32.768 kHz]
6.0
Icc (mA) ()
4.0
2.0
0.0 2.5 3.0 3.5 4.0 4.5 VCC(V)
16.8 MHz
5.0
5.5
6.0
Fig. 15 Flash memory version power source current standard characteristics (in high-speed mode, f(XIN) = 16.8 MHz, A-D converter operating)
Oscillation stop mode (TYP, 25 C) [STP instruction executing, XIN = stopped, XCIN = stopped]
1.0 0.8
Icc (A)
0.6 0.4
0.2 0.0 2.5 3.0 3.5 4.0 4.5 Vcc (V)
Stopped
5.0
5.5
6.0
Fig. 16 Flash memory version power source current standard characteristics (at oscillation stopping)
REJ99B1814-0200/Rev2.00
September 2009
Page 8 of 22
3803 Group (Spec.L) Standard characteristics
1.3 Mask ROM version port standard characteristics
Port P60 IOH-VOH characteristics (P-channel drive) [Ta = 25 C] (Same characteristics pins: P0, P1, P2, P30, P31, P34-P37, P4, P5, P6)
-50 -45 -40 -35
IOH -30 [mA] -25
-20 -15 -10 -5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Vcc = 5V
4.0
4.5
5.0
5.5
VOH[V]
Fig. 17 CMOS output port P-channel side characteristics (Ta = 25 C)
Port P60 IOL-VOL characteristics (N-channel drive) [Ta = 25 C] (Same characteristics pins: P0, P1, P3, P4, P5, P6)
50 45 40 35
Vcc = 5V
IOL [mA]
30 25 20 15 10 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VOL[V]
Fig. 18 CMOS output port N-channel side characteristics (Ta = 25 C)
REJ99B1814-0200/Rev2.00
September 2009
Page 9 of 22
3803 Group (Spec.L) Standard characteristics
Port P32 IOL-VOL characteristics (N-channel drive) [Ta = 25 C] (Same characteristics pins: P32, P33)
50 45 40 35
Vcc = 5 V
IOL [mA]
30 25 20 15 10 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VOL[V]
Fig. 19 N-channel open-drain output port N-channel side characteristics (Ta = 25 C)
Port P20 IOL-VOL characteristics (N-channel drive) [Ta = 25 C] (Same characteristics pins: P2)
100 90 80 70
Vcc = 5 V
IOL [mA]
60 50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VOL[V]
Fig. 20 CMOS large current output port N-channel side characteristics (Ta = 25 C)
REJ99B1814-0200/Rev2.00
September 2009
Page 10 of 22
3803 Group (Spec.L) Standard characteristics
Port P60 IIL-VIL characteristics (at pull-up) [Ta = 25 C] (Same characteristics pins: P0, P1, P2, P30, P31, P34-P37, P4, P5, P6)
-400 -360 -320 -280
IIL -240 [mA] -200
-160 -120 -80 -40 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vcc = 5 V Vcc = 3 V
VIL[V]
Fig. 21 CMOS input port at pull-up characteristics (Ta = 25 C)
REJ99B1814-0200/Rev2.00
September 2009
Page 11 of 22
3803 Group (Spec.L) Standard characteristics
1.4 Flash memory version port standard characteristics
Port P60 IOH-VOH characteristics (P-channel drive) [Ta = 25 C] (Same characteristics pins: P0, P1, P2, P30, P31, P34-P37, P4, P5, P6)
-50 -45 -40 -35
Vcc = 5.0 V Vcc = 4.0V
IOH -30 [mA] -25
-20 -15 -10 -5 0 0 0.5 1.0 1.5
Vcc = 2.7V
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VOH [V]
Fig. 22 CMOS output port P-channel side characteristics (Ta = 25 C)
Port P60 IOL-VOL characteristics (N-channel drive) [Ta = 25 C] (Same characteristics pins: P0, P1, P3, P4, P5, P6)
50 45 40 35
Vcc = 5.0 V
IOL [mA]
30 25 20 15 10 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vcc = 4.0 V
Vcc = 2.7 V
VOL[V]
Fig. 23 CMOS output port N-channel side characteristics (Ta = 25 C)
REJ99B1814-0200/Rev2.00
September 2009
Page 12 of 22
3803 Group (Spec.L) Standard characteristics
Port P32 IOL-VOL characteristics (N-channel drive) [Ta = 25 C] (Same characteristics pins: P32, P33)
50 45 40 35
Vcc = 5.0 V
IOL [mA]
30 25 20 15 10 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vcc = 4.0 V
Vcc = 2.7 V
VOL[V]
Fig. 24 N-channel open-drain output port N-channel side characteristics (Ta = 25 C)
Port P20 IOL-VOL characteristics (N-channel drive) [Ta = 25 C] (Same characteristics pins: P2)
100 90 80 70
Vcc = 5.0 V
IOL [mA]
60 50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0
Vcc = 4.0 V
Vcc = 2.7 V
3.5
4.0
4.5
5.0
5.5
VOL[V]
Fig. 25 CMOS large current output port N-channel side characteristics (Ta = 25 C)
REJ99B1814-0200/Rev2.00
September 2009
Page 13 of 22
3803 Group (Spec.L) Standard characteristics
Port P60 IIL-VIL characteristics (at pull-up) [Ta = 25 C] (Same characteristics pins: P0, P1, P2, P30, P31, P34-P37, P4, P5, P6)
-400 -360 -320 -280
Vcc = 6.0 V Vcc = 5.0 V
IIL -240 [mA] -200
-160 -120 -80 -40 0 0 0.5 1.0 1.5
Vcc = 3.0 V
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VIL[V]
Fig. 26 CMOS input port at pull-up characteristics (Ta = 25 C)
REJ99B1814-0200/Rev2.00
September 2009
Page 14 of 22
3803 Group (Spec.L) Standard characteristics
1.5 A-D conversion standard characteristics Figure. 27 and Figure. 28 show the mask ROM version A-D conversion standard characteristics. Figure. 29, Figure. 30, and Figure. 31 show the flash memory version A-D conversion standard characteristics. The thick lines of the graph indicate the absolute precision errors, These are expressed as the deviation from the ideal value when the output code changes. For example, the change in output code from 512 to 513 should occur at 2560 mV, but the measured value is -1.0 mV. Accordingly, the measured point of change is 2560 - 1.0 = 2559 mV. The thin lines of the graph indicate the input voltage width for which the output code is constant. For example, the measured input voltage width for which the output code is 512 is 5.0 mV, so that the differential non-linear error is 5.0 - 5.0 = 0.0 mV (0 LSB).
REJ99B1814-0200/Rev2.00
September 2009
Page 15 of 22
3803 Group (Spec.L) Standard characteristics
M38039MFL-001SP A-D CONV. ERROR & STEP WIDTH
VDD = 5.12 [V], VREF = 5.12 [V] XIN = 8 [MHz], Ta = 25 [deg.] Error 1 LSB Width
Fig. 27 Mask ROM version A-D conversion standard characteristics (f(XIN) = 8 MHz)
REJ99B1814-0200/Rev2.00
September 2009
Page 16 of 22
3803 Group (Spec.L) Standard characteristics
M38039MFL-001SP A-D CONV. ERROR & STEP WIDTH
VDD = 5.12 [V], VREF = 5.12 [V] XIN = 12 [MHz], Ta = 25 [deg.] Error 1 LSB Width
Fig. 28 Mask ROM version A-D conversion standard characteristics (f(XIN) = 12 MHz)
REJ99B1814-0200/Rev2.00
September 2009
Page 17 of 22
3803 Group (Spec.L) Standard characteristics
M38039FFLSP A-D CONV. ERROR & STEP WIDTH
VDD = 5.12 [V], VREF = 5.12 [V] XIN = 8 [MHz], Ta = 25 [deg.] Error 1 LSB Width
Fig. 29 Flash memory version A-D conversion standard characteristics (f(XIN) = 8 MHz)
REJ99B1814-0200/Rev2.00
September 2009
Page 18 of 22
3803 Group (Spec.L) Standard characteristics
M38039FFLSP A-D CONV. ERROR & STEP WIDTH
VDD = 5.12 [V], VREF = 5.12 [V] XIN = 12 [MHz], Ta = 25 [deg.] Error 1 LSB Width
Fig. 30 Flash memory version A-D conversion standard characteristics (f(XIN) = 12 MHz)
REJ99B1814-0200/Rev2.00
September 2009
Page 19 of 22
3803 Group (Spec.L) Standard characteristics
M38039FFLSP A-D CONV. ERROR & STEP WIDTH
VDD = 5.12 [V], VREF = 5.12 [V] XIN = 16 [MHz], Ta = 25 [deg.] Error 1 LSB Width
Fig. 31 Flash memory version A-D conversion standard characteristics (f(XIN) = 16 MHz)
REJ99B1814-0200/Rev2.00
September 2009
Page 20 of 22
3803 Group (Spec.L) Standard characteristics
1.6 D-A conversion standard characteristics Figure. 32 shows the mask ROM version D-A conversion standard characteristics. Figure. 33 shows the flash memory version D-A conversion standard characteristics.
M38039MFL-001SP D-A CONV. STEP WIDTH MEASUREMENT
VCC = 5.12 [V], VREF = 5.12 [V] XIN = 16 [MHz], Ta = 25 [deg.] Error 1 LSB Width
30 20
30 20 10
ERROR[mV]
10 0 -10 -20 -30 0 8 16 24 32 40 48 56 64 72 STEP No. 80 88 96 104 112 120
0
-10 -20 -30 128
30 20
30 20 10 0 -10 -20
ERROR[mV]
10 0 -10 -20 -30 128 136 144 152 160 168 176 184 192 200 STEP No. 208 216 224 232 240 248
-30 256
Fig. 32 Mask ROM version D-A conversion standard characteristics (revised in rev. 2.00)
REJ99B1814-0200/Rev2.00
September 2009
Page 21 of 22
1LSB WIDTH[mV]
1LSB WIDTH[mV]
3803 Group (Spec.L) Standard characteristics
M38039FFLSP D-A CONV. STEP WIDTH MEASUREMENT
VCC = 5.12 [V], VREF = 5.12 [V] XIN = 16 [MHz], Ta = 25 [deg.] Error 1 LSB Width
Fig. 33 Flash memory version D-A conversion standard characteristics
REJ99B1814-0200/Rev2.00
September 2009
Page 22 of 22
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010 Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
Notice
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